What is Substrate Like PCB (SLP) Technology?
- Substrate-like PCBs (SLP) is a term describing a high-density printed circuit board (PCB) that has feature sizes close to that of an IC substrate.
- Developed as an organic alternative to high-end ceramic packaging.
- Developed as an alternative to “build-up” (HDI) organic chip carrier packaging
Drivers for SLP Technology
- Increasing Packaging Density:
- Smaller lines and spaces – 25-28 um line width / 25-33 um space
- Smaller vias – 50-75 um buried thru, 40-70 um blind.
- Added wiring layers up to 12 Layers.
- Enables packaging flip-chip pitches to 180 um (150 um possible for specific lower I/O designs)
Substrate Like PCB (SLP) – SiP Capability
Original PCB Size: 108in2- Final sip size : 4in2
- Place size: 55x55mm, 683um thick
- Substrate: Particle-filled epoxy
- X-section 3-4-3
- 5um vias, 30/35um Line/space
- 84ft HDI Wiring
- >39,000 40-micron UV – laser drilled vias
- 5 Flip Chip FPGA
- 4 Xilinx FPGA, 3264 I/O w/190um minimum pitch
- Discretes components:0201 minimum size
- 638 SMT components placed
- Functional final socket & Bed of Nails topside test
- Custom Peripheral Pin connector & lid
SiP Implementation
EMSxchange Enables you to select a Printed Circuit Board, PCB Assembly, cable & wire harness assembly, and box-build suppliers meeting your Required Electronic Manufacturing Capability, capacity, and Certification Criteria from a global Electronic contact manufacturer base.
EMSxchange takes complete responsibility and ownership for your electronic manufacturing process and all its deliverables from contract manufacturing supplier selection to manufacturing to quality inspection to shipment and delivery to your door.
EMSxchange Electronic Manufacturing Partners Profile includes:
Argus Systems (AESPL) – PCB, PCBA, Cable Assembly, Box Build, Testing.
