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HDVP Engineered Thermal Solutions (ETS)

Customer Challenges

  • Components mounted on PCB surfaces are overheating
    • System density is ever increasing
    • Engineers are forced to place more power in less space
  • Traditional PCBs have very poor thermal performance.
  • Thinner PCBs (0.015” –0.025”) have multiple challenges when fitted with embedded copper coins.
  • Engineered Thermal Solutions (ETS) is an innovative approach that improves PCB thermal performance while enhancing layout flexibility.
HDVP Engineered Thermal Solutions (ETS)
  • Drill spacing can be tangentially touching.
  • Fill options can be customized
    • 100% Cu fill
    • Cu plating with Via Fill
  • Layout flexibility allows for nearly any geometry to be created;
    • Helps to maximize PCB area utilization and achieve smaller designs
    • High density via pattern can customize for each thermal load.
    • Traces can be routed through multiple angels and layers
    • Via patterns can be very small and more flexible versus standard coins
Drill spacing

ETS technology is an enhanced replacement of embedded copper coins in thin boards 15 – 25 mils (0.38 – 0.635 mm) thick

  • ETS can be applied in 2 ways
    • 1:1 direct coin replacement
    • Selective improvement to specific thermal areas
  • Selective ETS can be very small and more flexible versus standard coins
    • Smallest ETS area – 0.015” x 0.030” (0.38 x 0.76mm)
    • As a reference, Coin Size in the image below – 0.24” square (6.1mm)
  • Selective ETS greatly improved PCB space utilization
    • ETS requires only 30% space required for direct coin replacement (For this application)
    • Helps to reduce design size and layer count
Engineered Thermal Solutions
Engineered Thermal Solutions
Engineered Thermal Solutions

Engineering Thermal Solution(ETS)

Engineered Thermal Solutions

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