HDI PCB Manufacturing Process
The following is an outline of the manufacturing process to produce an 8-layer IPC Type II HDI printed circuit
IPC Classifications For Rigid PCBs
The Institute for Interconnecting and Packaging Electronic Circuits (IPC) IPC 6011/6012 Circuit Classifications (Rigid Circuits)
- Type 1
- Single-Sided
- Type 2
- Double-Sided
- Type 3
- Multilayer without blind or buried vias
- Type 4
- Multilayer with blind and/or buried vias
- Type 5
- Metal core Multilayer without blind or buried vias
- Type 6
- Metal core Multilayer with blind and/or buried vias
IPC Classifications For HDI PCBs
The Institute for Interconnecting and Packaging Electronic Circuits (IPC) IPC 2226A Classification of HDI Types
- Type 1
- 1 [C] 0 or 1 [C] 1 – with through vias connecting the outer layers
- Type 2
- 1 [C] 0 or 1 [C] 1 – with buried vias in the core and may have through vias connecting the outer layers
- Type 3
- ≥ 2 [C] ≥ 0 – may have buried vias in the core and may have through vias connecting the outer layers
- Type 4
- ≥ 1 [P] ≥ 0 – where P is a passive substrate with no electrical connection
- Type 5
- Coreless constructions using layer pairs
- Type 6
- Alternate constructions
Basic Process Flow
Manufacturing Instructions (MI)
- Analyze data (Gerber file, drawings, netlist, etc.)
- Raise issues in TQ and confirm with the customer
- Create Manufacturing Instructions and CAM
Instructions
CAD/CAM
- Panelize Customer data (step and repeat data on a panel)
- Add test / TDR coupons & tooling locations
- Create Drill files, Layer files, Rout files, Electrical test data, etc.
- CAD Reference files (each layer) for AOI
Panelization
1+6+1 HDI
Start production with cores (inner layers) first
Epoxy-Glass Laminate Construction
- Dielectric constant of the composite laminate is a function of the resin/glass ratio
- Composite laminates can have many different resin/glass constructions
- Heavy glass fabric can have fiber bundles that are Larger than the actual copper trace
Inner Layer
Pressing (Lamination)
Inner Layer (Sub-Assembly)
Inner Layer (Sub-Assembly) -> Outer Layer
Outer Layer
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