PCB Fabrication DFM Guidelines
Avoid Throwing Your Design Over the Wall Not Every PCB Shop Are Created Equal Define migration path from Prototypes to Final Fabrication and approve stack-up with Final Fabrication site(s) Design…
Avoid Throwing Your Design Over the Wall Not Every PCB Shop Are Created Equal Define migration path from Prototypes to Final Fabrication and approve stack-up with Final Fabrication site(s) Design…
Copper Foil Treatment Process for Printed Circuit Board in India The treatment process converts “drum” foil to foil now suitable for lamination and PCB processing Copper Foil Definitions DSTF (Drum Side Treated…
What is Substrate Like PCB (SLP) Technology? Substrate-like PCBs (SLP) is a term describing a high-density printed circuit board (PCB) that has feature sizes close to that of an IC…
CAF failures What exactly is CAF? Conductive Anodic Filament CAF is the Formation of Solid Cu Filament between different nets within PCB at different potentials. Follows a glass weave pathway…
Back drilling Technology Overview Back drilling, or controlled depth counter boring, is a process where plating is removed from the unused portion of the via. Multi-layer Printed Circuit Boards (PCBs)…
PCB Thermal Management - Thermal Via To operate efficiently and ensure reliability, heat must be removed from heat-generating power components. As a result of faster speeds, reduced format, and more…
LDI helps Elimination of Photo Tools No Film/Artwork Movement Quick Turn Made Easy Run product as soon as Engineering releases data to the floor Reduction in Defect Count.Direct Write =…
Definition of Reliability Reliability is the ability of an apparatus, machine, or system to consistently perform its intended or required function or mission, on-demand and without degradation or failure. Military…
What is considered a Microvia? Laser Drilled Blind Via from the outer layer to an inner layer 150 µm (0.006”) diameter laser drill (range 100 µm (0.004”) – 200 µm…
HDI PCB Manufacturing Process The following is an outline of the manufacturing process to produce an 8-layer IPC Type II HDI printed circuit IPC Classifications For Rigid PCBs The Institute…