What are PCB Testing Types ?
PCB Testing Types PCB testing is undoubtedly the most significant step in the PCB manufacturing process because of how crucial printed circuit boards are to our daily lives and how…
PCB Depanelization
PCB Depanelization PCB panelization is a manufacturing technique in which smaller boards are manufactured and connected together in array form, making it easier to move through an assembly line. The…
FMEA of PCB Assembly Process
What is FMEA? FMEA (Failure Mode and Effects Analysis) is a method for identifying probable failure modes in a system, as well as their causes and effects, by analysing as…
PCB Assembly X-ray
X-ray Inspection in Electronic Manufacturing X-ray inspection technology, often known as automatic X-ray inspection, is a type of X-ray inspection (AXI). These are unique rays with incredibly short wavelengths and…
Solder Paste Printing Process
Procedure to Inspect Stencil. To fulfill technological demands in today's manufacturing environment, ever-increasing levels of technology necessitate higher product quality, as well as improved inspection and quality control. Stencil number…
Press-fit Assembly
Press-fit Assembly in PCB A press-fit connection works on the premise of pressing a contact terminal into a printed circuit board (PCB). Press-fit pins are divided into two types: solid…
PCB Assembly Flying Probe Testing
Flying probe testing of PCBs Flying probe testing uses "flying" test probes that move from one test point to the next in accordance with the instructions provided by the individual…
PCB Cleaning Procedure
How to Clean Circuit Board Corrosion? PCB cleaning process with an ultrasonic cleaner is the quickest and most efficient approach to remove accumulated dirt, dust, and other microscopic particles. Now,…
PCB Potting Process
Potting Electronics PCB potting is a method used to protect circuit boards by filling the PCB's enclosure with a liquid material called a potting compound or encapsulation resin. The potting…
How to Avoid PCB Assembly Warpage?
PCB Assembly Warpage The substrate (copper clad) may be one of the causes of PCB Assembly Warpage, but thermal stress, chemical impacts, and faulty production techniques can also cause printing…