Photonics Customer Challenge
Next-generation Integrated Coherent Transmitter & Receiver Optical Sub-Assembly (IC-TROSA) are targeting 100G+
- Increased demand for high-speed bandwidth.
- Increased component density.
- Thermal management challenges.
- Cost challenges.
- Current Thin Film, HTCC, and LTCC solutions are expensive with long lead times.
- Application requires innovation to achieve performance and cost goals.
- High-frequency multi-layer PCBs bonded directly to ceramic substrates
- Superior RF performance from Organic PCB materials leveraging copper conductors
- Structural stability and thermal advantages of the ceramic substrate
- Replaces traditional LTCC and HTCC ‘gold box’ assemblies addressing cost reduction and performance improvement targets for the emerging ultrahigh-speed photonics market
- Innovation leverages patented mixed material fusion bonding process
- “Near Hermetic” performance for photonic applications (RGA testing data available on request)
- Addresses cost and performance challenges
EMSxchange Enables you to select a Printed Circuit Board, PCB Assembly, cable & wire harness assembly, and box-build suppliers meeting your Required Electronic Manufacturing Capability, capacity, and Certification Criteria from a global Electronic contact manufacturer base.
EMSxchange takes complete responsibility and ownership for your electronic manufacturing process and all its deliverables from contract manufacturing supplier selection to manufacturing to quality inspection to shipment and delivery to your door.
EMSxchange Electronic Manufacturing Partners Profile includes:
Argus Systems (AESPL) – PCB, PCBA, Cable Assembly, Box Build, Testing.
