PCB & PCB Assembly
Bare boards, SMT, through-hole and mixed-technology assembly — prototype through production volume, sourced and managed end to end.
Turnkey or consigned
One quote covers the board, the parts and the build
Send us the Gerbers, BOM, pick-and-place file and assembly drawing. We run a design-for-manufacture review, match the job to suppliers whose line, feeder count and inspection equipment actually suit it, and come back with a costed quote — not a placeholder.
You can go fully turnkey, where we buy the bare boards and every component through franchised distribution, or consign the parts you already hold and let us handle the rest. Either way the purchase order, the yield reports and the delivery sit with one team.
Get a quote- DFM and DFT review before the first board is cut
- Franchised-distributor sourcing with full component traceability
- IPC-A-610 Class 2 and Class 3 workmanship
- Lead-free and leaded processes, mixed-technology lines
- AOI, X-ray for BGA and bottom-terminated parts, ICT and functional test
- Conformal coating, potting and selective solder where the design needs it
Capabilities
PCB assembly capability at a glance
Every supplier on the platform is audited for the process it is being asked to run, not just for holding a certificate.
SMT assembly
Down to 01005 passives, 0.3 mm pitch BGA, QFN, LGA, CSP and package-on-package, on single or double-sided boards.
Through-hole & mixed
Wave, selective and hand soldering for connectors, transformers and press-fit parts alongside surface-mount devices.
Inspection
3D solder paste inspection, automated optical inspection, X-ray for hidden joints, and first-article verification against the BOM.
Coating & protection
Acrylic, silicone and urethane conformal coating, potting and encapsulation for automotive, outdoor and industrial builds.
Documentation
Full traceability pack: date and lot codes, reflow profiles, AOI images, test logs and certificate of conformance.
Board fabrication
Rigid, flex and rigid-flex from 1 to 24 layers, FR4, high-Tg, aluminium-backed and Rogers material sets.
Technical envelope
What our network can build
Typical limits across the qualified supplier base. Outside this envelope? Ask — the network is wider than the table.
| Parameter | Range |
|---|---|
| Layer count | 1 – 24 layers, rigid, flex and rigid-flex |
| Board size | 10 × 10 mm up to 500 × 600 mm |
| Smallest passive | 01005 (0402 metric) |
| Minimum BGA pitch | 0.3 mm, including micro-BGA and CSP |
| Board thickness | 0.4 mm – 3.2 mm |
| Solder process | Lead-free (SAC305), leaded, and mixed on request |
| Workmanship standard | IPC-A-610 Class 2 and Class 3 |
| Batch size | 5-piece prototypes to 100,000+ per year |
| Prototype lead time | From 5 working days after component availability |
How it runs
From enquiry to delivered product
Share your data pack
Gerbers, BOM, centroid file, assembly drawing and test spec. NDA first if you prefer.
DFM and sourcing review
We flag manufacturability risks, check part availability and lifecycle, and propose alternates where a line item is at risk.
Quote and supplier match
A costed quote against a named, audited supplier with the right line for your board — with lead time committed.
First article and approval
First-article samples with an inspection report. Production only starts after you sign off.
Production and inspection
In-process AOI and X-ray, plus our own quality checks before the shipment is released.
Delivery to your door
Consolidated shipment, customs handled, ASN sent to EDI-connected customers.
Do you have a project we can help with?
Send your BOM, Gerber files and drawings — you get a costed, capability-matched quote back.
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